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"Compact lumped element model for TSV in 3D-ICs."

Khaled Salah et al. (2011)

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DOI: 10.1109/ISCAS.2011.5938067

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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  dblp key:
  - conf/iscas/SalahRRAI11
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  - https://dblp.org/rec/conf/iscas/SalahRRAI11
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail:
Compact lumped element model for TSV in 3D-ICs. ISCAS 2011: 2321-2324

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