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"3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise ..."

Nahid Mirzaie, Ron Rohrer (2021)

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DOI: 10.1109/ISQED51717.2021.9424326

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-17

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  dblp key:
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  - https://dblp.org/rec/conf/isqed/MirzaieR21
Nahid Mirzaie, Ron Rohrer:
3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise Shielding, and High Interconnect Density. ISQED 2021: 269-274

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