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"Ultra-Thin Chips on Foil for Flexible Electronics."

Horst Rempp et al. (2008)

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DOI: 10.1109/ISSCC.2008.4523193

access: closed

type: Conference or Workshop Paper

metadata version: 2017-08-23

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  - conf/isscc/RemppBHPPRRSZ08
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  - https://dblp.org/rec/conf/isscc/RemppBHPPRRSZ08
Horst Rempp, Joachim N. Burghartz, Christine Harendt, Nicoleta Pricopi, Marcus Pritschow, Christian Reuter, Harald Richter, Inge Schindler, Martin Zimmermann:
Ultra-Thin Chips on Foil for Flexible Electronics. ISSCC 2008: 334-335

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