"EMspice 2.0: Multiphysics Electromigration Analysis Tool for Beyond Moore ICs."

Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan (2024)

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DOI: 10.1109/ISVLSI61997.2024.00108

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-31

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Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan:
EMspice 2.0: Multiphysics Electromigration Analysis Tool for Beyond Moore ICs. ISVLSI 2024: 571-576

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