"Thermal Analysis of 3D Stacking and BEOL Technologies with Functional ..."

Mohamed Naeim et al. (2024)

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DOI: 10.1109/ISVLSI61997.2024.00018

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type: Conference or Workshop Paper

metadata version: 2024-10-01

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Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic:
Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC. ISVLSI 2024: 33-38

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