"Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs."

Bing Shi, Ankur Srivastava, Avram Bar-Cohen (2012)

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DOI: 10.1109/ISVLSI.2012.29

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-05

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Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. ISVLSI 2012: 33-38

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