"Wafer-level Variation Modeling for Multi-site RF IC Testing via ..."

Michihiro Shintani et al. (2021)

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DOI: 10.1109/ITC50571.2021.00018

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Michihiro Shintani, Riaz-ul-haque Mian, Michiko Inoue, Tomoki Nakamura, Masuo Kajiyama, Makoto Eiki:
Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process. ITC 2021: 103-112

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