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"Predicting die-level process variations from wafer test data for analog ..."

Shyam Kumar Devarakond et al. (2013)

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DOI: 10.1109/LATW.2013.6562658

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  - https://dblp.org/rec/conf/latw/DevarakondMNCBC13
Shyam Kumar Devarakond, Jennifer McCoy, Amit Nahar, John M. Carulli Jr., Soumendu Bhattacharya, Abhijit Chatterjee:
Predicting die-level process variations from wafer test data for analog devices: A feasibility study. LATW 2013: 1-6

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