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"Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated ..."

Piotr Zajac, Melvin Galicia, Andrzej Napieralski (2018)

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DOI: 10.23919/MIXDES.2018.8436886

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

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Piotr Zajac, Melvin Galicia, Andrzej Napieralski:
Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels. MIXDES 2018: 258-261

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