"A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip ..."

Stephen Adamshick, Sandhiya Reddy Govindarajulu, Elias A. Alwan (2020)

> Home

Details and statistics

DOI: 10.1109/MWSCAS48704.2020.9184617

access: closed

type: Conference or Workshop Paper

metadata version: 2020-09-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/mwscas/AdamshickGA20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/mwscas/AdamshickGA20
Stephen Adamshick, Sandhiya Reddy Govindarajulu, Elias A. Alwan:
A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications. MWSCAS 2020: 537-540

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.