"Through Silicon Via-Based Grid for Thermal Control in 3D Chips."

José L. Ayala et al. (2009)

Details and statistics

DOI: 10.1007/978-3-642-04850-0_14

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

a service of  Schloss Dagstuhl - Leibniz Center for Informatics