"Silicon etching characteristics for the TMAH based solution with additives."

Ki-Wha Jun, Jung-Sik Kim (2015)

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DOI: 10.1109/NEMS.2015.7147479

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Ki-Wha Jun, Jung-Sik Kim:
Silicon etching characteristics for the TMAH based solution with additives. NEMS 2015: 507-510

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