"High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si ..."

Xianshu Luo et al. (2015)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-09

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  dblp key:
  - conf/ofc/LuoCSHLYWL15
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  persistent URL:
  - https://dblp.org/rec/conf/ofc/LuoCSHLYWL15
Xianshu Luo, Yulian Cao, Junfeng Song, Xiaonan Hu, Tsung-Yang Liow, Mingbin Yu, Qijie Wang, Guo-Qiang Lo:
High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers. OFC 2015: 1-3

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