"Tri-layer, vertical Y-junction, Si3N4/SiO2 3D photonic integrated circuits ..."

Kuanping Shang et al. (2016)

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type: Conference or Workshop Paper

metadata version: 2024-09-26

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Kuanping Shang, Shibnath Pathak, Binbin Guan, Guangyao Liu, Shaoqi Feng, S. J. Ben Yoo:
Tri-layer, vertical Y-junction, Si3N4/SiO2 3D photonic integrated circuits with arbitrary splitting ratio. OFC 2016: 1-3

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