"Packaging and Assembly Challenges for 50G Silicon Photonics Interposers."

Bradley Snyder et al. (2018)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-11

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  dblp key:
  - conf/ofc/SnyderMLBSPRBHV18
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  - https://dblp.org/rec/conf/ofc/SnyderMLBSPRBHV18
Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout:
Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. OFC 2018: 1-3

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