"Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4."

Mariana Ucker et al. (2018)

> Home

Details and statistics

DOI: 10.1109/SBCCI.2018.8533262

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-20

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/sbcci/UckerAASZPA18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/sbcci/UckerAASZPA18
Mariana Ucker, Vladimir Afonso, Luan Audibert, Altamiro Amadeu Susin, Bruno Zatt, Marcelo Schiavon Porto, Luciano Volcan Agostini:
Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4. SBCCI 2018: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.