"Opportunities of Chip Power Integrity and Performance Improvement through ..."

Rongmei Chen et al. (2022)

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DOI: 10.1145/3557988.3569716

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-19

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Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne:
Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. SLIP 2022: 3:1-3:5

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