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"Impact of nano-scale through-silicon vias on the quality of today and ..."

Daehyun Kim, Suyoun Kim, Sung Kyu Lim (2011)

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DOI: 10.1109/SLIP.2011.6135435

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Daehyun Kim, Suyoun Kim, Sung Kyu Lim:
Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. SLIP 2011: 1-8

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