"Efficient Metal Inter-Layer Via Utilization Strategies for ..."

Umamaheswara Rao Tida, Madhava Sarma Vemuri (2020)

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DOI: 10.1109/SOCC49529.2020.9524756

access: closed

type: Conference or Workshop Paper

metadata version: 2021-09-14

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Umamaheswara Rao Tida, Madhava Sarma Vemuri:
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. SoCC 2020: 195-200

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