"3D-IC BISR for stacked memories using cross-die spares."

Chun-Chuan Chi et al. (2012)

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DOI: 10.1109/VLSI-DAT.2012.6212621

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Chun-Chuan Chi, Yung-Fa Chou, Ding-Ming Kwai, Yu-Ying Hsiao, Cheng-Wen Wu, Yu-Tsao Hsing, Li-Ming Denq, Tsung-Hsiang Lin:
3D-IC BISR for stacked memories using cross-die spares. VLSI-DAT 2012: 1-4

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