"On the futility of thermal through-silicon-vias."

Chung-Han Chou et al. (2013)

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DOI: 10.1109/VLDI-DAT.2013.6533886

access: closed

type: Conference or Workshop Paper

metadata version: 2025-12-07

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Chung-Han Chou, Nien-Yu Tsai, Hao Yu, Yiyu Shi, Jui-Hung Chien, Shih-Chieh Chang:
On the futility of thermal through-silicon-vias. VLSI-DAT 2013: 1-6

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