"TSV-aware 3D test wrapper chain optimization."

Yu-Yi Wu, Shih-Hsu Huang (2018)

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DOI: 10.1109/VLSI-DAT.2018.8373262

access: closed

type: Conference or Workshop Paper

metadata version: 2018-06-13

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Yu-Yi Wu, Shih-Hsu Huang:
TSV-aware 3D test wrapper chain optimization. VLSI-DAT 2018: 1-4

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