"Design and feasibility of multi-Gb/s quasi-serial vertical interconnects ..."

Fengda Sun et al. (2010)

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DOI: 10.1109/VLSISOC.2010.5642604

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Fengda Sun, Alessandro Cevrero, Panagiotis Athanasopoulos, Yusuf Leblebici:
Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs. VLSI-SoC 2010: 149-154

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