"Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked ..."

Jung-Won Han et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185290

access: closed

type: Conference or Workshop Paper

metadata version: 2024-09-09

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Jung-Won Han, S. H. Park, Moonyoung Jeong, K. N. Kim, H. J. Kim, J. C. Shin, S. M. Park, S. H. Shin, S. W. Park, K. S. Lee, J. H. Lee, S. H. Kim, B. C. Kim, Myoung H. Jung, I. Y. Yoon, H. Kim, S. U. Jang, K. J. Park, Y. K. Kim, I. G. Kim, J. H. Oh, S. Y. Han, B. S. Kim, Bong Jin Kuh, J. M. Park:
Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked DRAM -. VLSI Technology and Circuits 2023: 1-2

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