"AMD Instinct™ MI300X Accelerator: Packaging and Architecture ..."

Alan Smith et al. (2024)

> Home

Details and statistics

DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631545

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-18

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/vlsit/SmithLWNHMMJS24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/vlsit/SmithLWNHMMJS24
Alan Smith, Gabriel H. Loh, John J. Wuu, Samuel Naffziger, Tyrone Huang, Hugh McIntyre, Ramon Mangaser, Wonjun Jung, Raja Swaminathan:
AMD Instinct™ MI300X Accelerator: Packaging and Architecture Co-Optimization. VLSI Technology and Circuits 2024: 1-2

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.