"A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using ..."

Suresh Venkatesan et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830432

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-04

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Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Brian Pile, Daniel Meerovich, Jinyu Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, Aaron Voon-Yew Thean, Yeow Kheng Lim:
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer^TM. VLSI Technology and Circuits 2022: 381-382

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