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"Thermal Modeling and Management Challenges in Heterogenous Integration: ..."

Jaehyun Park et al. (2024)

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DOI: 10.1109/VTS60656.2024.10538578

access: closed

type: Conference or Workshop Paper

metadata version: 2024-06-03

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  dblp key:
  - conf/vts/ParkKPSSTDPO24
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  - https://dblp.org/rec/conf/vts/ParkKPSSTDPO24
Jaehyun Park, Alish Kanani, Lukas Pfromm, Harsh Sharma, Parth Solanki, Eric Tervo, Janardhan Rao Doppa, Partha Pratim Pande, Ümit Y. Ogras:
Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5D Chiplet Platforms and Beyond. VTS 2024: 1-4

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