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"Multi-Dimensional Integration and Packaging of Devices for ..."

Nazek El-Atab et al. (2020)

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DOI: 10.1109/WF-IOT48130.2020.9221305

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/wf-iot/El-AtabSAAASKH20
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  - https://dblp.org/rec/conf/wf-iot/El-AtabSAAASKH20
Nazek El-Atab, Reema Suwaidan, Yara Alghamdi, Alhanouf Alhazzany, Reema Almansour, Sohail Faizan Shaikh, Sherjeel M. Khan, Muhammad Mustafa Hussain:
Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications. WF-IoT 2020: 1-6

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