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"Electrical investigation of Cu pumping in through-silicon vias for BEOL ..."

Chuan-An Cheng et al. (2015)

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DOI: 10.1109/3DIC.2015.7334581

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen:
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC 2015: TS8.12.1-TS8.12.4

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