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"Thermal analysis and modeling of 3D integrated circuits for test scheduling."

Indira Rawat, M. K. Gupta, Virendra Singh (2013)

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DOI: 10.1109/3DIC.2013.6702374

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Indira Rawat, M. K. Gupta, Virendra Singh:
Thermal analysis and modeling of 3D integrated circuits for test scheduling. 3DIC 2013: 1-5

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