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"Small-diameter TSV reveal process using direct Si/Cu grinding and metal ..."

Naoya Watanabe et al. (2014)

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DOI: 10.1109/3DIC.2014.7152144

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/WatanabeAKBMY14
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  - https://dblp.org/rec/conf/3dic/WatanabeAKBMY14
Naoya Watanabe, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, Eiichi Yamamoto:
Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal. 3DIC 2014: 1-5

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