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"Thermal challenges for heterogeneous 3D ICs and opportunities for air gap ..."

Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir (2014)

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DOI: 10.1109/3DIC.2014.7152174

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir:
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 3DIC 2014: 1-5

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