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"Keeping hot chips cool: are IC thermal problems hot air?"

Ruchir Puri et al. (2008)

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DOI: 10.1145/1391469.1391632

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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  dblp key:
  - conf/dac/PuriVEWFYK08
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  - https://dblp.org/rec/conf/dac/PuriVEWFYK08
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul D. Franzon, Andrew Yang, Stephen V. Kosonocky:
Keeping hot chips cool: are IC thermal problems hot air? DAC 2008: 634-635

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