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"An intercell busbar topology to improve resilience to anomalies of copper ..."

Eduardo P. Wiechmann et al. (2016)

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DOI: 10.1109/IAS.2016.7731926

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Eduardo P. Wiechmann, Pablo Aqueveque, Jorge A. Henriquez, Aníbal S. Morales:
An intercell busbar topology to improve resilience to anomalies of copper electrorefining process. IAS 2016: 1-6

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