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"Thermal impact of 3D stacking and die thickness: Analysis and ..."

Cristiano Santos, Pascal Vivet, Ricardo Augusto da Luz Reis (2014)

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DOI: 10.1109/ICECS.2014.7050086

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-16

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  - conf/icecsys/SantosVR14
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Cristiano Santos, Pascal Vivet, Ricardo Augusto da Luz Reis:
Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit. ICECS 2014: 718-721

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