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"FEM simulation and experimental analysis of a thermal tactile slip device."

Zhen Jia et al. (2013)

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DOI: 10.1109/ICNC.2013.6817990

access: closed

type: Conference or Workshop Paper

metadata version: 2023-04-05

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  dblp key:
  - conf/icnc/JiaLWWY13
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  - https://dblp.org/rec/conf/icnc/JiaLWWY13
Zhen Jia, Jianqing Li, Neng Wan, Jianfeng Wu, Yurong Yang:
FEM simulation and experimental analysis of a thermal tactile slip device. ICNC 2013: 302-306

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