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"Thermal-aware task scheduling for 3D-network-on-chip: A Bottom-to-Top scheme."

Yingnan Cui et al. (2014)

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DOI: 10.1109/ISICIR.2014.7029547

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/isicir/CuiZCLH14
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  - https://dblp.org/rec/conf/isicir/CuiZCLH14
Yingnan Cui, Wei Zhang, Vivek Chaturvedi, Weichen Liu, Bingsheng He:
Thermal-aware task scheduling for 3D-network-on-chip: A Bottom-to-Top scheme. ISIC 2014: 224-227

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