"Yield improvement of 3D ICs in the presence of defects in through signal vias."

Rajeev K. Nain, Shantesh Pinge, Malgorzata Chrzanowska-Jeske (2010)

Details and statistics

DOI: 10.1109/ISQED.2010.5450513

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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