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"Vernier ring based pre-bond through silicon vias test in 3D ICs."

Tianming Ni et al. (2017)

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DOI: 10.1587/ELEX.14.20170590

access: open

type: Journal Article

metadata version: 2021-02-12

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  - journals/ieiceee/NiNLBXFHW17
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  - https://dblp.org/rec/journals/ieiceee/NiNLBXFHW17
Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen:
Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express 14(18): 20170590 (2017)

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