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"A high-pass filter based on through-silicon via (TSV)."

Fengjuan Wang, Jia Huang, Ningmei Yu (2019)

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DOI: 10.1587/ELEX.16.20190098

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
  - journals/ieiceee/WangHY19
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  - https://dblp.org/rec/journals/ieiceee/WangHY19
Fengjuan Wang, Jia Huang, Ningmei Yu:
A high-pass filter based on through-silicon via (TSV). IEICE Electron. Express 16(10): 20190098 (2019)

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