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"Highlighting two integration technologies based on vias: Through silicon ..."

M. Balmont et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.077

access: closed

type: Journal Article

metadata version: 2021-10-14

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M. Balmont, Isabelle Bord-Majek, B. Poupard, Laurent Béchou, Yves Ousten:
Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectron. Reliab. 88-90: 1108-1112 (2018)

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