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"The impact of electrical current, mechanical bending, and thermal ..."

Yuki Fukuda, Michael D. Osterman, Michael G. Pecht (2007)

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DOI: 10.1016/J.MICROREL.2006.04.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yuki Fukuda, Michael D. Osterman, Michael G. Pecht:
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth. Microelectron. Reliab. 47(1): 88-92 (2007)

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