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"RF device package method using Au to Au direct bonding technology."

Sangwook Kwon et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.10.007

access: closed

type: Journal Article

metadata version: 2020-08-27

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  - https://dblp.org/rec/journals/mr/KwonKPHJS09
Sangwook Kwon, Jongseok Kim, Gilsu Park, Youngtack Hong, Byeong-Kwon Ju, Insang Song:
RF device package method using Au to Au direct bonding technology. Microelectron. Reliab. 49(1): 99-102 (2009)

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