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"Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic ..."

Tomi Laurila et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.08.007

access: closed

type: Journal Article

metadata version: 2020-03-24

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  - https://dblp.org/rec/journals/mr/LaurilaHVK09
Tomi Laurila, J. Hurtig, Vesa Vuorinen, Jorma K. Kivilahti:
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. Microelectron. Reliab. 49(3): 242-247 (2009)

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