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"Finite element model verification for packaged printed circuit board by ..."

Ying-Chih Lee et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.068

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen:
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48(11-12): 1837-1846 (2008)

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