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"Creep fatigue models of solder joints: A critical review."

Ee-Hua Wong et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.01.013

access: closed

type: Journal Article

metadata version: 2023-09-10

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Ee-Hua Wong, W. D. van Driel, Abhijit Dasgupta, Michael G. Pecht:
Creep fatigue models of solder joints: A critical review. Microelectron. Reliab. 59: 1-12 (2016)

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