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"Enhanced Double Via Insertion Using Wire Bending."

Kuang-Yao Lee, Shing-Tung Lin, Ting-Chi Wang (2010)

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DOI: 10.1109/TCAD.2009.2035559

access: closed

type: Journal Article

metadata version: 2020-09-24

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Kuang-Yao Lee, Shing-Tung Lin, Ting-Chi Wang:
Enhanced Double Via Insertion Using Wire Bending. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 29(2): 171-184 (2010)

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