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"Efficient thermal-oriented 3D floorplanning and thermal via planning for ..."

Zhuoyuan Li et al. (2006)

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DOI: 10.1145/1142155.1142159

access: closed

type: Journal Article

metadata version: 2018-11-06

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Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Jinian Bian, Hannah Honghua Yang, Vijay Pitchumani:
Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration. ACM Trans. Design Autom. Electr. Syst. 11(2): 325-345 (2006)

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