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"Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips."

Xiang Qiu, Malgorzata Marek-Sadowska, Wojciech P. Maly (2015)

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DOI: 10.1109/TVLSI.2014.2325551

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - journals/tvlsi/QiuMM15
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  - https://dblp.org/rec/journals/tvlsi/QiuMM15
Xiang Qiu, Malgorzata Marek-Sadowska, Wojciech P. Maly:
Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips. IEEE Trans. Very Large Scale Integr. Syst. 23(5): 869-878 (2015)

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