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"Thermomechanical Stress-Aware Management for 3-D IC Designs."

Qiaosha Zou, Eren Kursun, Yuan Xie (2017)

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DOI: 10.1109/TVLSI.2017.2707119

access: closed

type: Journal Article

metadata version: 2020-03-11

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  dblp key:
  - journals/tvlsi/ZouKX17
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  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/ZouKX17
Qiaosha Zou, Eren Kursun, Yuan Xie:
Thermomechanical Stress-Aware Management for 3-D IC Designs. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2678-2682 (2017)

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